lead-free parts pb ligitek electronics co.,ltd. property of ligitek only LSEF13740-PF data sheet doc. no : qw0905-LSEF13740-PF-08 rev. : a date : 05 - aug . - 2008 super bright round type led lamps
ligitek electronics co.,ltd. property of ligitek only package dimensions page 1/5 part no. LSEF13740-PF note : 1.all dimension are in millimeter tolerance is 0.25mm unless otherwise noted. 2.specifications are subject to change without notice. directivity radiation 2.54typ 7.6 8.6 1.5max 1.0min 25.0min 0.5 typ 5.9 5.0 60 30 0 75% 25% 0 50% 100% -30 -60 25% 75% 100%50%
605 * static electricity or power surge will damage the led. use of a conductive wrist band or anti-electrosatic glove is recommended when handing these led. all devices, equipment and machinery must be properly grounded. page 2/5 unit ma mw ma 25 65 60 symbol i f pd i fp ligitek electronics co.,ltd. property of ligitek only ratings orange parameter peak forward current duty 1/10@10khz power dissipation forward current absolute maximum ratings at ta=25 a v 10 ir t opr esd tstg -40 ~ +85 -40 ~ +100 2000 typ. 55068 min. 300 min. 1.7 max. 2.6 17 lens emitted orange orange diffused color forward voltage @20ma(v) spectral halfwidth nm viewing angle 2 1/2 (deg) luminous intensity @20ma(mcd) dominant wave length dnm reverse current @5v storage temperature material algainp part no LSEF13740-PF note : 1.the forward voltage data did not including 0.1v testing tolerance. 2. the luminous intensity data did not including 15% testing tolerance. typical electrical & optical characteristics (ta=25 ) operating temperature electrostatic discharge( * ) part no. LSEF13740-PF
fig.3 forward voltage vs. temperature fig.5 relative intensity vs. wavelength ambient temperature( ) f o r w a r d v o l t a g e @ 2 0 m a n o r m a l i z e @ 2 5 fig.4 relative intensity vs. temperature ambient temperature( ) r e l a t i v e i n t e n s i t y @ 2 0 m a n o r m a l i z e @ 2 5 forward voltage(v) fig.1 forward current vs. forward voltage f o r w a r d c u r r e n t ( m a ) forward current(ma) fig.2 relative intensity vs. forward current r e l a t i v e i n t e n s i t y n o r m a l i z e @ 2 0 m a ligitek electronics co.,ltd. property of ligitek only 1.0 0 10 20 1.0101001000 0.0 1.0 2.0 3.0 -200204060 1.0 1.1 1.2 2.03.0 80 0.8 0.9 -20 40 20 080 60 2.0 0.0 0.5 1.0 1.5 2.5 page 3/5 typical electro-optical characteristics curve sef chip 1.0 r e l a t i v e i n t e n s i t y @ 2 0 m a wavelength (nm) 500 0.0 0.5 550 600 650 0.51.52.5 0 30 50 40 60 part no. LSEF13740-PF
note: 1.wave solder should not be made more than one time. 2.you can just only select one of the soldering conditions as above. 2.wave soldering profile soldering condition(pb-free) 1.iron: soldering iron:30w max temperature 350 c max soldering time:3 seconds max(one time only) distance:2mm min(from solder joint to body) dip soldering preheat: 120 c max preheat time: 60seconds max ramp-up 2 c/sec(max) ramp-down:-5 c/sec(max) solder bath:260 c max dipping time:3 seconds max distance:2mm min(from solder joint to body) 0 25 0 260 120 preheat 2 /sec max 50 temp( c) 260 c3sec max 5 /sec max 100 time(sec) 150 ligitek electronics co.,ltd. property of ligitek only page 4/5 60 seconds max part no. LSEF13740-PF
1.ta=105 5 &-40 5 (10min) (10min) 2.total 10 cycles 1.t.sol=230 5 2.dwell time=5 1sec 1.t.sol=260 5 2.dwell time= 10 1sec. 1.ta=-40 5 2.t=1000 hrs (-24hrs, +72hrs) 1.ta=105 5 2.t=1000 hrs (-24hrs, +72hrs) 1.under room temperature 2.if=20ma 3.t=1000 hrs (-24hrs, +72hrs) test condition thermal shock test solderability test solder resistance test reliability test: high temperature storage test high temperature high humidity test low temperature storage test 1.ta=65 5 2.rh=90%~95% 3.t=240hrs 2hrs operating life test test item the purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. mil-std-202: 107d mil-std-750: 1051 mil-std-883: 1011 this test intended to see soldering well performed or not. this test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. mil-std-202: 208d mil-std-750: 2026 mil-std-883: 2003 jis c 7021: a-2 mil-std-202: 210a mil-std-750: 2031 jis c 7021: a-1 the purpose of this is the resistance of the device which is laid under condition of high temperature for hours. the purpose of this test is the resistance of the device under tropical for hours. the purpose of this is the resistance of the device which is laid under condition of low temperature for hours. this test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. description mil-std-883:1008 jis c 7021: b-10 mil-std-202:103b jis c 7021: b-11 jis c 7021: b-12 reference standard mil-std-750: 1026 mil-std-883: 1005 jis c 7021: b-1 ligitek electronics co.,ltd. property of ligitek only page 5/5 part no. LSEF13740-PF
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